标签: AI芯片

寒武纪给超8成员工发股票激励,人均160万;宇树员工掏2.7亿认购IPO,王兴兴自掏1500万;Altman自曝沉迷 TikTok:一刷就是 3 小时|AI周报

寒武纪给超8成员工发股票激励,人均160万;宇树员工掏2.7亿认购IPO,王兴兴自掏1500万;Altman自曝沉迷 TikTok:一刷就是 3 小时|AI周报

本周AI产业呈现“钱和人”两条主线:寒武纪用数百亿营收目标绑定超八成员工,字节跳动把飞书并入豆包团队,月之暗面估值冲到350亿美元;与此同时,宇树科技员工IPO认购、Claude隐私泄露等事件提醒市场,AI公司的治理和数据合规正在变得和模型能力一样重要。

Filing: Meta reports $279B in future lease agreements in Q2 related to AI data centers that are not reflected on its balance sheet, up 53% from the prior period (Shona Ghosh/Bloomberg)

Filing: Meta reports $279B in future lease agreements in Q2 related to AI data centers that are not reflected on its balance sheet, up 53% from the prior period (Shona Ghosh/Bloomberg)

Meta在2026年第二季度披露了总额2790亿美元的未来租赁协议,专门用于AI数据中心,且未体现在当前资产负债表上,金额比上一季度暴增53%。这揭示了全球头部AI公司正在以“租赁”形式锁定未来数年算力,其对数据中心基础设施的长期投入远超外界预期。

Sources: TSMC is developing advanced AI chip packaging tech, internally called “EMIB-like”, similar to Intel’s Embedded Multi-die Interconnect Bridge technique (Qianer Liu/The Information)

Sources: TSMC is developing advanced AI chip packaging tech, internally called "EMIB-like", similar to Intel's Embedded Multi-die Interconnect Bridge technique (Qianer Liu/The Information)

台积电正在开发一项名为“EMIB-like”的新型先进芯片封装技术,直接对标英特尔已有的EMIB技术。这项进展意味着AI芯片的关键竞争正从单纯的制程工艺延伸到封装互连领域,对下一代高性能AI加速器的算力密度和成本结构有直接影响。

The EU formally launches a bidding process to develop AI Gigafactories, expecting to unlock ~€30B of investment, closing on November 12 with awards in July 2027 (Edith Hancock/Wall Street Journal)

The EU formally launches a bidding process to develop AI Gigafactories, expecting to unlock ~€30B of investment, closing on November 12 with awards in July 2027 (Edith Hancock/Wall Street Journal)

欧盟于7月30日正式启动AI超级工厂(AI Gigafactories)招标,计划通过公私合作撬动约300亿欧元投资,投标截止今年11月12日,最终获奖项目将在2027年7月公布。这是欧洲在全球算力竞赛中关键的基础设施布局。